From October 28th to 30th, the 2025 Shenzhen International Film & Tape Expo was grandly held at the Shenzhen World Exhibition & Convention Center. At this highly influential industry event in the Asia-Pacific region, Kehong Jian made a significant appearance, focusing on its leading semiconductor packaging material solutions and showcasing multiple innovative products. The booth atmosphere was vibrant with active communication, attracting a continuous flow of professional visitors, making it one of the notable focal points of the exhibition.
Semiconductor Adhesive Film Zone: This zone highlighted high-performance adhesive film products used in processes like DFN dicing and chip fabrication dicing. With their excellent anti-static properties, ultra-low ionic impurity levels, and superior instant adhesion strength, these products ensure the smooth progress of semiconductor device dicing and grinding.
Electronic Protective Tape Zone: Products such as anti-static high-temperature tapes, PET high-temperature tapes, and crepe paper masks were gathered here, showcasing Kehong Jian's comprehensive solutions for PCB protection, high-temperature masking protection, and FPC manufacturing processes in the electronics industry. Their good temperature resistance and stable adhesion meet customers' stringent requirements for process protection.
Although the grand event has concluded, innovation never stops. This exhibition is not an endpoint but a brand new starting point for Kehong Jian. We gained cutting-edge market feedback, established broader industry connections, and further solidified our determination to drive the future through technological innovation. Moving forward, Kehong Jian will continue to deepen its expertise in the semiconductor packaging and electronic materials fields. We are committed to providing higher-quality products and more professional solutions, working hand-in-hand with industry partners to jointly promote the innovation and development of China's electronic materials.
